Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417957 | Structure and method related to a power module using a hybrid spacer | Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain, Roger M. Arbuthnot | 2025-09-16 |
| 12278158 | Leadframe spacer for double-sided power module | Tzu-Hsuan Cheng, Yong Liu | 2025-04-15 |
| 12062549 | Semiconductor packages and related methods | Yong Liu, Yusheng LIN | 2024-08-13 |
| 11842942 | Structure and method related to a power module using a hybrid spacer | Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain, Roger M. Arbuthnot | 2023-12-12 |
| 11830784 | Leadframe spacer for double-sided power module | Tzu-Hsuan Cheng, Yong Liu | 2023-11-28 |
| 11562938 | Spacer with pattern layout for dual side cooling power module | Yong Liu, Yusheng LIN, Chee Hiong CHEW | 2023-01-24 |
| 11282764 | Structure and method related to a power module using a hybrid spacer | Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain, Roger M. Arbuthnot | 2022-03-22 |
| 11121055 | Leadframe spacer for double-sided power module | Tzu-Hsuan Cheng, Yong Liu | 2021-09-14 |
| 11075090 | Semiconductor packages and related methods | Yong Liu, Yusheng LIN | 2021-07-27 |