Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packages and related methods

Semiconductor packages and related methods

US Patent 11075090 · Granted Jul 27, 2021

Estimated economic value: $17,457,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lighting apparatus2025
Semiconductor package electrical contacts and related methods2025
Emergency starting power supply for vehicle2025
Structure and method related to a power module using a hybrid spacer2025
Structure and method related to a power module using a hybrid spacer2025
Substrate structures and methods of manufacture2025
Power semiconductor device and preparation method thereof2025
Die sidewall coatings and related methods2025
Low stress asymmetric dual side module2025
Electron extraction type free-wheeling diode device and preparation method there2025
Module with substrate recess for conductive-bonding component2025
Low stress asymmetric dual side module2025