Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6588098 | Method for manufacturing an electronic device package | Boon Huat Lim, Kevin John Theseira, Kenneth Teik Kheong Low | 2003-07-08 |
| 6479893 | Ball-less clip bonding | Chee Chew Hiong | 2002-11-12 |
| 6475834 | Method of manufacturing a semiconductor component and semiconductor component thereof | Dave Culbertson, Chee Hiong CHEW | 2002-11-05 |
| 6436736 | Method for manufacturing a semiconductor package on a leadframe | Hou Boon Tan, Kuan Ming Kan | 2002-08-20 |
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Kenneth Teik Kheong Low, Chee Hiong CHEW, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |
| 5973388 | Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe | Chee Hiong CHEW, Hin Kooi Chee | 1999-10-26 |