Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7598600 | Stackable power semiconductor package system | Wai Kwong Tang, You Yang Ong, Larry Lewellen | 2009-10-06 |
| 7557432 | Thermally enhanced power semiconductor package system | Wai Kwong Tang, You Yang Ong, Larry Lewellen | 2009-07-07 |
| 6436736 | Method for manufacturing a semiconductor package on a leadframe | Saat Shukri Embong, Hou Boon Tan | 2002-08-20 |