WT

Wai Kwong Tang

SC Stats Chippac: 2 patents #228 of 425Top 55%
📍 Singapore, SG: #4,165 of 13,971 inventorsTop 30%
Overall (All Time): #2,136,765 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7598600 Stackable power semiconductor package system You Yang Ong, Kuan Ming Kan, Larry Lewellen 2009-10-06
7557432 Thermally enhanced power semiconductor package system You Yang Ong, Kuan Ming Kan, Larry Lewellen 2009-07-07