Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6588098 | Method for manufacturing an electronic device package | Boon Huat Lim, Saat Shukri Embong, Kevin John Theseira | 2003-07-08 |
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Saat Shukri Embong, Chee Hiong CHEW, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |