Issued Patents All Time
Showing 126–150 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096460 | Semiconductor wafer and method of wafer thinning using grinding phase and separation phase | — | 2018-10-09 |
| 10090233 | Semiconductor device and method of forming micro interconnect structures | Francis J. Carney, Jefferson W. Hall | 2018-10-02 |
| 10083868 | Semiconductor die singulation methods | — | 2018-09-25 |
| 10079199 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2018-09-18 |
| 10014245 | Method for removing material from a substrate using in-situ thickness measurement | Francis J. Carney | 2018-07-03 |
| 9991164 | Semiconductor die singulation methods | — | 2018-06-05 |
| 9935045 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Francis J. Carney | 2018-04-03 |
| 9905525 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Takashi Noma, Kazuhiro Saito | 2018-02-27 |
| 9893058 | Method of manufacturing a semiconductor device having reduced on-state resistance and structure | Francis J. Carney | 2018-02-13 |
| 9852972 | Semiconductor device and method of aligning semiconductor wafers for bonding | Francis J. Carney | 2017-12-26 |
| 9847310 | Flip chip bonding alloys | Francis J. Carney | 2017-12-19 |
| 9847219 | Semiconductor die singulation method | William F. Burghout, Dennis Lee Conner, Jay A. Yoder, Gordon M. Grivna | 2017-12-19 |
| 9793186 | Semiconductor wafer and method of backside probe testing through opening in film frame | Heng Chen Lee | 2017-10-17 |
| 9711434 | Stacked semiconductor device structure and method | Francis J. Carney | 2017-07-18 |
| 9564409 | Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel | Francis J. Carney | 2017-02-07 |
| 9484210 | Semiconductor die singulation method | William F. Burghout, Dennis Lee Conner, Jay A. Yoder, Gordon M. Grivna | 2016-11-01 |
| 9437493 | Method of forming a semiconductor die | Gordon M. Grivna | 2016-09-06 |
| 9337098 | Semiconductor die back layer separation method | William F. Burghout | 2016-05-10 |
| 9299664 | Method of forming an EM protected semiconductor die | Francis J. Carney, Gordon M. Grivna | 2016-03-29 |
| 9275957 | EM protected semiconductor die | Francis J. Carney, Gordon M. Grivna | 2016-03-01 |
| 9263390 | Semiconductor component that includes a protective structure | Francis J. Carney | 2016-02-16 |
| 9219010 | Method of manufacturing a semiconductor component | Francis J. Carney | 2015-12-22 |
| 9165833 | Method of forming a semiconductor die | Gordon M. Grivna | 2015-10-20 |
| 9034733 | Semiconductor die singulation method | William F. Burghout, Dennis Lee Conner, Jay A. Yoder, Gordon M. Grivna | 2015-05-19 |
| 8871613 | Semiconductor die singulation method | — | 2014-10-28 |