| 12501649 |
Power device with graded channel |
Keunseok CHO, Bog Kyu LEE, Kyung Man Park, Doojin CHOI, James Joseph VICTORY |
2025-12-16 |
|
| 12125884 |
MOSFET device with undulating channel |
Kevin Kyuheon CHO, Bongyong Lee, Kyeongseok PARK, Doojin CHOI, Ki Min KIM |
2024-10-22 |
$55,909,000 |
| 11880642 |
Systems and methods for designing a discrete device product |
James Joseph VICTORY, YunPeng Xiao, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA +6 more |
2024-01-23 |
$42,136,000 |
| 11817478 |
Termination structures with reduced dynamic output capacitance loss |
Jaume Roig-Guitart, Fredrik Allerstam, Andrei Konstantinov, Martin Domeij, Jangkwon Lim |
2023-11-14 |
$57,100,000 |
| 11658214 |
MOSFET device with undulating channel |
Kevin Kyuheon CHO, Bongyong Lee, Kyeongseok PARK, Doojin CHOI, Ki Min KIM |
2023-05-23 |
$86,922,000 |
| 11652027 |
Vertical transistors with gate connection grid |
Herbert De Vleeschouwer, Fredrik Allerstam |
2023-05-16 |
$45,536,000 |
| 11605732 |
Power device with graded channel |
Kevin Kyuheon CHO, Bongyong Lee, Kyeongseok PARK, Doojin CHOI, James Joseph VICTORY |
2023-03-14 |
$56,065,000 |
| 11481532 |
Systems and methods for designing a discrete device product |
James Joseph VICTORY, YunPeng Xiao, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA +7 more |
2022-10-25 |
$60,408,000 |
| 11398437 |
Power device including metal layer |
Bongyong Lee, Bohee Kang, Doojin CHOI, Kyeongseok PARK, Jeongwoo YANG |
2022-07-26 |
$97,665,000 |
| 11373859 |
Semiconductor substrate singulation systems and related methods |
Michael J. Seddon, Fredrik Allerstam |
2022-06-28 |
$45,920,000 |
| 11152211 |
Semiconductor wafer thinning systems and related methods |
Michael J. Seddon |
2021-10-19 |
$22,975,000 |
| 10950596 |
Diode with current sensor |
Xiang Zeng, Xiaoli Wu, Hao Wang, Hocheol Jang, Sungkyu Song |
2021-03-16 |
$24,844,000 |
| 10896815 |
Semiconductor substrate singulation systems and related methods |
Michael J. Seddon, Fredrik Allerstam |
2021-01-19 |
$23,689,000 |
| 10665458 |
Semiconductor wafer thinning systems and related methods |
Michael J. Seddon |
2020-05-26 |
$22,108,000 |
| 10629686 |
Carbon-controlled ohmic contact layer for backside ohmic contact on a silicon carbide power semiconductor device |
Thi Thu Ha Pham, Kyeongseok PARK, Andrei Konstantinov |
2020-04-21 |
$15,073,000 |
| 10388526 |
Semiconductor wafer thinning systems and related methods |
Michael J. Seddon |
2019-08-20 |
$6,859,000 |
| 7191085 |
Method for testing an electric circuit |
Erwin Thalmann, Martin Versen |
2007-03-13 |
$424,000 |
