Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12253476 | Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system | Dermot Cantwell, Quentin Ernie Walker, Serghei Malkov | 2025-03-18 |
| 11874234 | Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system | Dermot Cantwell, Quentin Ernie Walker, Serghei Malkov | 2024-01-16 |
| 11665158 | Wireless signal authentication via biometric pattern detection | Hong Xiong, Song Wang, Mengnan Wang | 2023-05-30 |
| 11585764 | Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system | Dermot Cantwell, Quentin Ernie Walker, Serghei Malkov | 2023-02-21 |
| D958490 | Underwear | Nitin Pal | 2022-07-26 |
| 11200877 | Face mask for facilitating conversations | Mengnan Wang, Song Wang, Hong Xiong | 2021-12-14 |
| 11087538 | Presentation of augmented reality images at display locations that do not obstruct user's view | Ming Qian, John Weldon Nicholson, Song Wang, David Alexander Schwarz | 2021-08-10 |
| 10789425 | Generating a response to a natural language command based on a concatenated graph | Ming Qian, John Weldon Nicholson, David Alexander Schwarz, Song Wang | 2020-09-29 |
| 10770036 | Presentation of content on left and right eye portions of headset | Song Wang, John Weldon Nicholson, Ming Qian | 2020-09-08 |
| 10741175 | Systems and methods for natural language understanding using sensor input | Ming Qian, Song Wang, John Weldon Nicholson | 2020-08-11 |
| 10622189 | Adjustable side gas plenum for edge rate control in a downstream reactor | Andrew Stratton Bravo, Joydeep Guha | 2020-04-14 |
| 10614794 | Adjust output characteristic | Ming Qian, John Weldon Nicholson, Jun-Ki Min | 2020-04-07 |
| 9740894 | Silent RFID state and restore back | Hong Zhao | 2017-08-22 |
| 8525321 | Conductive chip disposed on lead semiconductor package | David Chong | 2013-09-03 |
| 8519521 | Electronic device including a packaging substrate having a trench | Shutesh Krishnan, Chee Hiong CHEW | 2013-08-27 |
| 8268676 | Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads | Shutesh Krishnan, Chee Hiong CHEW | 2012-09-18 |
| 7939380 | Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure | Shutesh Krishnan, Soon Wei WANG | 2011-05-10 |
| 7402895 | Semiconductor package structure and method of manufacture | Shutesh Krishnan | 2008-07-22 |