Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9018044 | Chip-on-lead package and method of forming | Atapol Prajuckamol, Bih Wen Fon | 2015-04-28 |
| 8759978 | Chip-on-lead package and method of forming | Atapol Prajuckamol, Bih Wen Fon | 2014-06-24 |