Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318380 | Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant | Youngjoon KIM, SangMi Park | 2016-04-19 |
| 9059108 | Integrated circuit packaging system with interconnects | DaeSik Choi, JoonYoung Choi | 2015-06-16 |
| 8816404 | Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant | Youngjoon KIM, SangMi Park | 2014-08-26 |
| 8546194 | Integrated circuit packaging system with interconnects and method of manufacture thereof | JoonYoung Choi, DaeSik Choi | 2013-10-01 |