Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418112 | Antenna structure and electronic device including same | Chanju PARK, Sanghyuk WI, Taeksun KWON, JungWoo Seo, Junhwa OH | 2025-09-16 |
| 12388166 | Antenna module and electronic device comprising same | Chanju PARK, Jungi JEONG, Taeksun KWON, JungWoo Seo, Junhwa OH | 2025-08-12 |
| 12142021 | Electronic apparatus, controlling method of electronic apparatus, and computer readable medium | Junkwon Choi, Sangkyu Kang, Kyuchun Han | 2024-11-12 |
| 12081181 | Variable-gain amplifiers with configurable baluns | Hanseung Lee, Weimin Sun | 2024-09-03 |
| 11652453 | Tunable baluns for multimode power amplification | Hanseung Lee, Weimin Sun | 2023-05-16 |
| 11558545 | Electronic apparatus, controlling method of electronic apparatus, and computer readable medium | Junkwon Choi, Sangkyu Kang, Kyuchun Han | 2023-01-17 |
| 11211911 | Capacitive-coupled bandpass filter | Hanseung Lee, Weimin Sun | 2021-12-28 |
| 9865453 | Semiconductor devices including device isolation structures and methods of manufacturing the same | Daehyun Moon, Hyeoungwon Seo, Ilgweon Kim, Jooyoung Lee | 2018-01-09 |
| 9825142 | Methods of fabricating semiconductor devices | Hyeoungwon Seo, Daehyun Moon, Jooyoung Lee, Ilgweon Kim | 2017-11-21 |
| 8704365 | Integrated circuit packaging system having a cavity | DongSam Park | 2014-04-22 |
| 8035210 | Integrated circuit package system with interposer | JoungIn Yang, In Sang Yoon | 2011-10-11 |
| 7989950 | Integrated circuit packaging system having a cavity | DongSam Park | 2011-08-02 |
| 7901987 | Package-on-package system with internal stacking module interposer | JoungIn Yang | 2011-03-08 |
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Joungln Yang, DongSam Park | 2011-01-04 |