Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9054098 | Integrated circuit packaging system with redistribution layer and method of manufacture thereof | NamJu Cho, HeeJo Chi | 2015-06-09 |
| 8530277 | Integrated circuit packaging system with package on package support and method of manufacture thereof | Sangjin Lee | 2013-09-10 |
| 8455300 | Integrated circuit package system with embedded die superstructure and method of manufacture thereof | HeeJo Chi, NamJu Cho | 2013-06-04 |
| 8304296 | Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof | Junwoo Myung, WonIl Kwon | 2012-11-06 |
| 8217502 | Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof | — | 2012-07-10 |