Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406579 | Semiconductor device and method of controlling warpage in semiconductor package | DaeSik Choi, JoungIn Yang, Sang Mi Park, YiSu Park | 2016-08-02 |
| 9401289 | Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces | Minjung Kim, KyungHoon Lee, JoungIn Yang, DaeSik Choi | 2016-07-26 |
| 8304296 | Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof | ChanHoon Ko, Junwoo Myung | 2012-11-06 |