Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9190297 | Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures | DaeSik Choi, HyungMin Lee | 2015-11-17 |
| 9153476 | Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die | HeeJo Chi, HyungMin Lee | 2015-10-06 |
| 8723309 | Integrated circuit packaging system with through silicon via and method of manufacture thereof | HanGil Shin, HeeJo Chi | 2014-05-13 |
| 8710668 | Integrated circuit packaging system with laser hole and method of manufacture thereof | HyungMin Lee, HeeJo Chi | 2014-04-29 |
| 8587129 | Integrated circuit packaging system with through silicon via base and method of manufacture thereof | HeeJo Chi, NamJu Cho | 2013-11-19 |
| 8426955 | Integrated circuit packaging system with a stack package and method of manufacture thereof | HeeJo Chi, HyungMin Lee | 2013-04-23 |
| 8357564 | Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die | HeeJo Chi, HyungMin Lee | 2013-01-22 |