Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Rajendra D. Pendse | 2011-07-26 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Hun Teak Lee, Jong Kook Kim, ChulSik Kim | 2011-03-22 |
| 7772683 | Stacked integrated circuit package-in-package system | Jong-Woo Ha, Jong Wook Ju | 2010-08-10 |
| 7745322 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Rajendra D. Pendse | 2010-06-29 |
| 7741726 | Integrated circuit underfill package system | Hyung Jun Jeon, Dae-Wook Yang | 2010-06-22 |
| 7731078 | Semiconductor system with fine pitch lead fingers | Hun Teak Lee, Jong Kook Kim, ChulSik Kim | 2010-06-08 |
| 7679177 | Integrated circuit packaging system with passive components | — | 2010-03-16 |
| 7537962 | Method of fabricating a shielded stacked integrated circuit package system | Youngmin Kim, Hyung Jun Jeon | 2009-05-26 |
| 7485502 | Integrated circuit underfill package system | Hyung Jun Jeon, Dae-Wook Yang | 2009-02-03 |
| 7453156 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Rajendra D. Pendse | 2008-11-18 |
| 7407080 | Wire bond capillary tip | Kenny Lee, Hun Teak Lee, Jong Kook Kim, ChulSik Kim | 2008-08-05 |