Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851893 | Semiconductor device and method of connecting a shielding layer to ground through conductive vias | Seung-Won Kim | 2010-12-14 |
| 7741726 | Integrated circuit underfill package system | Hyung Jun Jeon, Ki Youn Jang | 2010-06-22 |
| 7485502 | Integrated circuit underfill package system | Hyung Jun Jeon, Ki Youn Jang | 2009-02-03 |