| 8987056 |
Integrated circuit package system with support carrier and method of manufacture thereof |
Jong-Woo Ha, Sung Yoon Lee |
2015-03-24 |
| 8659175 |
Integrated circuit package system with offset stack |
Jong Wook Ju, Hyun Joung Kim |
2014-02-25 |
| 8618653 |
Integrated circuit package system with wafer scale heat slug |
WonJun Ko, Sungmin Song |
2013-12-31 |
| 8409921 |
Integrated circuit package system including honeycomb molding |
Heap Hoe Kuan, Hamid Eslampour, DaeSik Choi, Rui Huang |
2013-04-02 |
| 8217501 |
Integrated circuit package system including honeycomb molding |
Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Jong Wook Ju |
2012-07-10 |
| 8067831 |
Integrated circuit package system with planar interconnects |
Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Jong Wook Ju |
2011-11-29 |
| 8067275 |
Integrated circuit package system with package integration |
WonJun Ko, Jong Wook Ju, SeungYong Chai, Ja Eun Yun |
2011-11-29 |
| 7969023 |
Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof |
JaEun Yun, Byung Joon Han |
2011-06-28 |
| 7737539 |
Integrated circuit package system including honeycomb molding |
Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Jong Wook Ju |
2010-06-15 |
| 7656017 |
Integrated circuit package system with thermo-mechanical interlocking substrates |
Hyun Joung Kim, Ja Eun Yun |
2010-02-02 |
| 7443037 |
Stacked integrated circuit package system with connection protection |
Hyun Joung Kim, Jong Wook Ju |
2008-10-28 |