HK

Hyun Joung Kim

SC Stats Chippac: 6 patents #121 of 425Top 30%
LG: 5 patents #7,897 of 26,165Top 35%
📍 Michuhol-gu, KR: #1 of 12 inventorsTop 9%
Overall (All Time): #464,335 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
8659175 Integrated circuit package system with offset stack Jong Wook Ju, Taeg Ki Lim 2014-02-25
8217501 Integrated circuit package system including honeycomb molding Hyeog Chan Kwon, Jae-Chang Kim, Taeg Ki Lim, Jong Wook Ju 2012-07-10
8059065 Method and apparatus for driving electro-luminescence display panel Guen Bae Park, Won Kyu Ha 2011-11-15
7978157 Electro-luminescence display Jung Min Seo, Won Kyu Ha, Hak Su Kim, Guen Bae Park, Eun Myung Park +1 more 2011-07-12
7737539 Integrated circuit package system including honeycomb molding Hyeog Chan Kwon, Jae-Chang Kim, Taeg Ki Lim, Jong Wook Ju 2010-06-15
7687920 Integrated circuit package-on-package system with central bond wires DeokKyung Yang, Jae Han Chung 2010-03-30
7663589 Electro-luminescence display device and driving method thereof Won Kyu Ha, Hak Su Kim, Jae Do Lee, Ki Heon Kim, Jung Min Seo 2010-02-16
7656017 Integrated circuit package system with thermo-mechanical interlocking substrates Taeg Ki Lim, Ja Eun Yun 2010-02-02
7646365 Method and apparatus for driving electro-luminescence display device with multiple scan drive currents Hak Su Kim 2010-01-12
7511688 Electro-luminescence display Jung Min Seo, Won Kyu Ha, Hak Su Kim, Guen Bae Park, Eun Myung Park +1 more 2009-03-31
7443037 Stacked integrated circuit package system with connection protection Jong Wook Ju, Taeg Ki Lim 2008-10-28