Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8956914 | Integrated circuit package system with overhang die | Jong Wook Ju | 2015-02-17 |
| 8067275 | Integrated circuit package system with package integration | WonJun Ko, Jong Wook Ju, SeungYong Chai, Taeg Ki Lim | 2011-11-29 |
| 7656017 | Integrated circuit package system with thermo-mechanical interlocking substrates | Hyun Joung Kim, Taeg Ki Lim | 2010-02-02 |