| 8623704 |
Adhesive/spacer island structure for multiple die package |
Sang Ho Lee, Jong Wook Ju |
2014-01-07 |
| 8552551 |
Adhesive/spacer island structure for stacking over wire bonded die |
Sang Ho Lee, Jong Wook Ju, Marcos Karnezos |
2013-10-08 |
| 8375576 |
Method for manufacturing wafer scale heat slug system |
— |
2013-02-19 |
| 8217501 |
Integrated circuit package system including honeycomb molding |
Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim, Jong Wook Ju |
2012-07-10 |
| 8102043 |
Stacked integrated circuit and package system and method for manufacturing thereof |
Tae Sung Jeong, Youngcheol Kim |
2012-01-24 |
| 8067831 |
Integrated circuit package system with planar interconnects |
Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim, Jong Wook Ju |
2011-11-29 |
| 8049322 |
Integrated circuit package-in-package system and method for making thereof |
Choong Bin Yim, Jong-Woo Ha |
2011-11-01 |
| 8030134 |
Stacked semiconductor package having adhesive/spacer structure and insulation |
Marcos Karnezos |
2011-10-04 |
| 7975377 |
Wafer scale heat slug system |
— |
2011-07-12 |
| 7932593 |
Multipackage module having stacked packages with asymmetrically arranged die and molding |
— |
2011-04-26 |
| 7884460 |
Integrated circuit packaging system with carrier and method of manufacture thereof |
Choong Bin Yim, Jong-Woo Ha |
2011-02-08 |
| 7875966 |
Stacked integrated circuit and package system |
Tae Sung Jeong, Youngcheol Kim |
2011-01-25 |
| 7755180 |
Integrated circuit package-in-package system |
Choong Bin Yim, Jong-Woo Ha |
2010-07-13 |
| 7737539 |
Integrated circuit package system including honeycomb molding |
Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim, Jong Wook Ju |
2010-06-15 |
| 7652376 |
Integrated circuit package system including stacked die |
Soo-San Park, Sang Ho Lee, Jong-Woo Ha |
2010-01-26 |
| 7545031 |
Multipackage module having stacked packages with asymmetrically arranged die and molding |
— |
2009-06-09 |
| 7501697 |
Integrated circuit package system |
Choong Bin Yim, Jong-Woo Ha |
2009-03-10 |
| 7456088 |
Integrated circuit package system including stacked die |
Soo-San Park, Sang Ho Lee, Jong-Woo Ha |
2008-11-25 |
| 7306971 |
Semiconductor chip packaging method with individually placed film adhesive pieces |
Jin-Wook Jeong, In Sang Yoon, Hee Bong Lee, Hyun Joon Oh, Jong Wook Ju +1 more |
2007-12-11 |
| 7288835 |
Integrated circuit package-in-package system |
Choong Bin Yim, Jong-Woo Ha |
2007-10-30 |