Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9699638 | Apparatus and method for providing integrated device information | Seung-Pyo Hong, Dong-Wook Lee | 2017-07-04 |
| 9362210 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Young Nam Choi +1 more | 2016-06-07 |
| 8410585 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Young Nam Choi +1 more | 2013-04-02 |
| 7535085 | Semiconductor package having improved adhesiveness and ground bonding | — | 2009-05-19 |
| 7067908 | Semiconductor package having improved adhesiveness and ground bonding | — | 2006-06-27 |
| 7042068 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Young Nam Choi +1 more | 2006-05-09 |
| 6867071 | Leadframe including corner leads and semiconductor package using same | Choon Heung Lee, Su Yol Yoo | 2005-03-15 |
| 6853059 | Semiconductor package having improved adhesiveness and ground bonding | — | 2005-02-08 |
| 6555899 | Semiconductor package leadframe assembly and method of manufacture | Young Suk Chung, Jae Hak Yee | 2003-04-29 |
| 6525406 | Semiconductor device having increased moisture path and increased solder joint strength | Young Suk Chung, Jae Jin Lee, Tae Heon Lee, Hyung Ju Lee, Jung Woo Lee +3 more | 2003-02-25 |