KH

Kock Liang Heng

SC Stats Chippac: 10 patents #83 of 425Top 20%
📍 Singapore, SG: #766 of 13,971 inventorsTop 6%
Overall (All Time): #514,191 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
9054083 Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more 2015-06-09
9029193 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Pandi C. Marimuthu, Nathapong Suthiwongsunthorn 2015-05-12
8659162 Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more 2014-02-25
8263439 Semiconductor device and method of forming an interposer package with through silicon vias Pandi C. Marimuthu, Nathapong Suthiwongsunthorn, Il Kwon Shim 2012-09-11
8125073 Wafer integrated with permanent carrier and method therefor Byung Joon Han, Nathapong Suthiwongsunthorn, Pandi C. Marimuthu 2012-02-28
8067308 Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more 2011-11-29
8049328 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Pandi C. Marimuthu, Nathapong Suthiwongsunthorn 2011-11-01
7880293 Wafer integrated with permanent carrier and method therefor Byung Joon Han, Nathapong Suthiwongsunthorn, Pandi C. Marimuthu 2011-02-01
7838337 Semiconductor device and method of forming an interposer package with through silicon vias Pandi C. Marimuthu, Nathapong Suthiwongsunthorn, Il Kwon Shim 2010-11-23
7741148 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Pandi C. Marimuthu, Nathapong Suthiwongsunthorn 2010-06-22