JK

Jae Hun Ku

AT Amkor Technology: 13 patents #47 of 595Top 8%
SC Stats Chippac: 9 patents #112 of 425Top 30%
SS St Assembly Test Services: 7 patents #6 of 63Top 10%
📍 Seoul, KR: #1,817 of 39,741 inventorsTop 5%
Overall (All Time): #131,821 of 4,157,543Top 4%
29
Patents All Time

Issued Patents All Time

Showing 26–29 of 29 patents

Patent #TitleCo-InventorsDate
6677663 End grid array semiconductor package Jae Hak Yee 2004-01-13
6646339 Thin and heat radiant semiconductor package and method for manufacturing Jae Hak Yee 2003-11-11
6616436 Apparatus for manufacturing semiconductor packages Hyung Ju Lee, Ku Sun Hong 2003-09-09
6448633 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more 2002-09-10