Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6616436 | Apparatus for manufacturing semiconductor packages | Hyung Ju Lee, Jae Hun Ku | 2003-09-09 |
| 6525406 | Semiconductor device having increased moisture path and increased solder joint strength | Young Suk Chung, Sung Sik Jang, Jae Jin Lee, Tae Heon Lee, Hyung Ju Lee +3 more | 2003-02-25 |