Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8692387 | Stacked die semiconductor package | Guoliang Gong, Xuesong Xu, Xingshou Pang, Beiyue Yan, Yinghui Li | 2014-04-08 |
| 8643153 | Semiconductor device with staggered leads | Zhigang Bai, Xuesong Xu, Beiyue Yan, You Ge | 2014-02-04 |
| 8643156 | Lead frame for assembling semiconductor device | Zhigang Bai, Haiyan Liu | 2014-02-04 |