Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728308 | Semiconductor device under bump structure and method therefor | Tsung Nan Lo, Antonio Aguinaldo Marquez Macatangay | 2023-08-15 |
| 8698288 | Flexible substrate with crimping interconnection | Boon Yew Low, Navas Khan Oratti Kalandar | 2014-04-15 |