Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7355289 | Packaged integrated circuit with enhanced thermal dissipation | Kevin J. Hess | 2008-04-08 |
| 7256488 | Semiconductor package with crossing conductor assembly and method of manufacture | Yaping Zhou | 2007-08-14 |
| 7049694 | Semiconductor package with crossing conductor assembly and method of manufacture | Yaping Zhou | 2006-05-23 |
| 6992377 | Semiconductor package with crossing conductor assembly and method of manufacture | Yaping Zhou | 2006-01-31 |
| 6937047 | Integrated circuit with test pad structure and method of testing | Tu-Anh N. Tran, Richard K. Eguchi, Peter R. Harper, William Williams, III, Lois Yong | 2005-08-30 |
| 6933614 | Integrated circuit die having a copper contact and method therefor | Fuaida Harun, Kevin J. Hess, Lan Chu Tan, Cheng Choi Yong | 2005-08-23 |
| 6225685 | Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins | Robert A. Newman, Melissa Lee | 2001-05-01 |
| 6196002 | Ball grid array package having thermoelectric cooler | Robert A. Newman | 2001-03-06 |