Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946833 | Packaging for semiconductor sensor devices and methods | — | 2015-02-03 |
| 8921994 | Thermally enhanced package with lid heat spreader | — | 2014-12-30 |
| 8907485 | Copper ball bond features and structure | Chu-Chung Lee | 2014-12-09 |
| 8853867 | Encapsulant for a semiconductor device | Sheila F. Chopin, Varughese Mathew, Chu-Chung Lee | 2014-10-07 |
| 8754521 | Semiconductor device assembly having a heat spreader | Burton J. Carpenter, Yuan Yuan | 2014-06-17 |
| 8716066 | Method for plating a semiconductor package lead | — | 2014-05-06 |
| 8674509 | Integrated circuit die assembly with heat spreader | Burton J. Carpenter | 2014-03-18 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same | Neil McLellan, Serafin P. Pedron, Jr., Kwok Cheung Tsang, Kin Pui Kwan | 2008-04-15 |
| 7348663 | Integrated circuit package and method for fabricating same | Mohan Kirloskar, Katherine Wagenhoffer | 2008-03-25 |
| 7344920 | Integrated circuit package and method for fabricating same | Mohan Kirloskar, Katherine Wagenhoffer | 2008-03-18 |
| 6437283 | Device and method for processing substrates | Udo Wiggermann, Alex Schreiner, Hans Mayer, Eddy Roelants | 2002-08-20 |
| 6294405 | Method of forming semiconductor device having a sub-chip-scale package structure | — | 2001-09-25 |
| 6064114 | Semiconductor device having a sub-chip-scale package structure and method for forming same | — | 2000-05-16 |
| 5985682 | Method for testing a bumped semiconductor die | — | 1999-11-16 |
| 5710071 | Process for underfilling a flip-chip semiconductor device | Stanley Craig Beddingfield, John C. Gentile | 1998-01-20 |
| 5686352 | Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff | — | 1997-11-11 |
| 5639989 | Shielded electronic component assembly and method for making the same | — | 1997-06-17 |
| 5583370 | Tab semiconductor device having die edge protection and method for making the same | John C. Gentile | 1996-12-10 |
| 5583377 | Pad array semiconductor device having a heat sink with die receiving cavity | — | 1996-12-10 |
| 5492863 | Method for forming conductive bumps on a semiconductor device | — | 1996-02-20 |
| 5468995 | Semiconductor device having compliant columnar electrical connections | — | 1995-11-21 |
| 5434452 | Z-axis compliant mechanical IC wiring substrate and method for making the same | — | 1995-07-18 |
| 5378981 | Method for testing a semiconductor device on a universal test circuit substrate | — | 1995-01-03 |
| 5361490 | Method for making tape automated bonding (TAB) semiconductor device | Maurice S. Karpman | 1994-11-08 |
| 5343074 | Semiconductor device having voltage distribution ring(s) and method for making the same | Aubrey K. Sparkman | 1994-08-30 |