HM

Hans Mayer

HM Hitachi Via Mechanics: 1 patents #43 of 109Top 40%
SA Siemens Aktiengesellschaft: 1 patents #10,653 of 22,248Top 50%
📍 Viernheim, DE: #60 of 133 inventorsTop 50%
Overall (All Time): #2,103,459 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7897893 Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam Alexander Kilthau, Marc Van Biesen 2011-03-01
6437283 Device and method for processing substrates Udo Wiggermann, Alex Schreiner, Leo M. Higgins, III, Eddy Roelants 2002-08-20