RJ

Robert E. Jones

Motorola: 22 patents #273 of 12,470Top 3%
FS Freeescale Semiconductor: 19 patents #113 of 3,767Top 3%
IN Invensas: 3 patents #76 of 142Top 55%
IC Isolyser Company: 1 patents #11 of 13Top 85%
The Dow Chemical: 1 patents #2,215 of 4,115Top 55%
UN Uniphase: 1 patents #9 of 30Top 30%
Overall (All Time): #60,987 of 4,157,543Top 2%
47
Patents All Time

Issued Patents All Time

Showing 25 most recent of 47 patents

Patent #TitleCo-InventorsDate
9837299 Methods of forming 3-D circuits with integrated passive devices Paul W. Sanders, Michael F. Petras, Chandrasekaram Ramiah 2017-12-05
9698131 Methods of forming 3-D circuits with integrated passive devices Paul W. Sanders, Michael F. Petras, Chandrasekaram Ramiah 2017-07-04
9236365 Methods of forming 3-D circuits with integrated passive devices Paul W. Sanders, Michael F. Petras, Chandrasekaram Ramiah 2016-01-12
8722459 Methods of forming 3-D circuits with integrated passive devices Paul W. Sanders, Michael F. Petras 2014-05-13
8344503 3-D circuits with integrated passive devices Paul W. Sanders, Michael F. Petras, Chandrasekaram Ramiah 2013-01-01
8242564 Semiconductor device with photonics Gregory S. Spencer, Jill C. Hildreth 2012-08-14
8093084 Semiconductor device with photonics Gregory S. Spencer, Jill C. Hildreth 2012-01-10
7994069 Semiconductor wafer with low-K dielectric layer and process for fabrication thereof Brad Smith, Cindy Goldberg 2011-08-09
7871854 Method of making a vertical photodetector Gregory S. Spencer 2011-01-18
7851340 Semiconductor fin integration using a sacrificial fin Rickey S. Brownson 2010-12-14
7772048 Forming semiconductor fins using a sacrificial fin Rickey S. Brownson 2010-08-10
7741218 Conductive via formation utilizing electroplating Terry G. Sparks 2010-06-22
7715227 Programmable ROM using two bonded strata Syed M. Alam 2010-05-11
7622313 Fabrication of three dimensional integrated circuit employing multiple die panels Scott K. Pozder 2009-11-24
7514340 Composite integrated device and methods for forming thereof Ajay Somani 2009-04-07
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof Syed M. Alam, Scott K. Pozder 2008-04-15
7288458 SOI active layer with different surface orientation Olubunmi O. Adetutu, Ted R. White 2007-10-30
7220632 Method of forming a semiconductor device and an optical device and structure thereof 2007-05-22
7074664 Dual metal gate electrode semiconductor fabrication process and structure thereof Ted R. White, Olubunmi O. Adetutu 2006-07-11
7030001 Method for forming a gate electrode having a metal Olubunmi O. Adetutu, Lynne Michaelson, Kathleen C. Yu 2006-04-18
6916669 Self-aligned magnetic clad write line and its method of formation Carole C. Barron, Eric D. Luckowski, Bradley M. Melnick 2005-07-12
6790727 Integration of two memory types on the same integrated circuit Bruce E. White 2004-09-14
6616854 Method of bonding and transferring a material to form a semiconductor device Sebastian Csutak 2003-09-09
6576532 Semiconductor device and method therefor Bruce E. White 2003-06-10
6555858 Self-aligned magnetic clad write line and its method of formation Carole C. Barron, Eric D. Luckowski, Bradley M. Melnick 2003-04-29