PS

Paul W. Sanders

Motorola: 12 patents #718 of 12,470Top 6%
FS Freeescale Semiconductor: 10 patents #296 of 3,767Top 8%
IN Invensas: 3 patents #76 of 142Top 55%
DA Department Of Veterans Affairs: 1 patents #199 of 615Top 35%
NU Nxp Usa: 1 patents #1,089 of 2,066Top 55%
TF The Uab Research Foundation: 1 patents #374 of 813Top 50%
TL Trw Limited: 1 patents #979 of 2,166Top 50%
📍 Scottsdale, AZ: #102 of 3,386 inventorsTop 4%
🗺 Arizona: #1,062 of 32,909 inventorsTop 4%
Overall (All Time): #138,663 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
9871008 Monolithic microwave integrated circuits Wayne R. Burger, Thuy B. Dao, Joel E. Keys, Michael F. Petras, Robert A. Pryor +1 more 2018-01-16
9837299 Methods of forming 3-D circuits with integrated passive devices Robert E. Jones, Michael F. Petras, Chandrasekaram Ramiah 2017-12-05
9698131 Methods of forming 3-D circuits with integrated passive devices Robert E. Jones, Michael F. Petras, Chandrasekaram Ramiah 2017-07-04
9508599 Methods of making a monolithic microwave integrated circuit Wayne R. Burger, Thuy B. Dao, Joel E. Keys, Michael F. Petras, Robert A. Pryor +1 more 2016-11-29
9236365 Methods of forming 3-D circuits with integrated passive devices Robert E. Jones, Michael F. Petras, Chandrasekaram Ramiah 2016-01-12
9064712 Monolithic microwave integrated circuit Wayne R. Burger, Thuy B. Dao, Joel E. Keys, Michael F. Petras, Robert A. Pryor +1 more 2015-06-23
8722459 Methods of forming 3-D circuits with integrated passive devices Robert E. Jones, Michael F. Petras 2014-05-13
8628781 Prevention and treatment of cast nephropathy 2014-01-14
8518764 Semiconductor structure having a through substrate via (TSV) and method for forming Thuy B. Dao, Joel E. Keys, Hernan Rueda 2013-08-27
8344503 3-D circuits with integrated passive devices Robert E. Jones, Michael F. Petras, Chandrasekaram Ramiah 2013-01-01
8329579 Through substrate VIAS Michael F. Petras, Chandrasekaram Ramiah 2012-12-11
8283207 Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods Chandrasekaram Ramiah, Douglas G. Mitchell, Michael F. Petras 2012-10-09
8062975 Through substrate vias Michael F. Petras, Chandrasekaram Ramiah 2011-11-22
7935571 Through substrate vias for back-side interconnections on very thin semiconductor wafers Chandrasekaram Ramiah, Douglas G. Mitchell, Michael F. Petras 2011-05-03
7803714 Semiconductor through silicon vias of variable size and method of formation Chandrasekaram Ramiah 2010-09-28
5734194 Semiconductor device and method of making Troy E. Mackie, Julio C. Costa, John L. Freeman, Jr., Alan Wood 1998-03-31
5670417 Method for fabricating self-aligned semiconductor component Charles T. Lambson 1997-09-23
5338397 Method of forming a semiconductor device 1994-08-16
5273940 Multiple chip package with thinned semiconductor chips 1993-12-28
5254491 Method of making a semiconductor device having improved frequency response Bernard W. Boland, Robert B. Davies 1993-10-19
5145795 Semiconductor device and method therefore Bernard W. Boland 1992-09-08
5139959 Method for forming bipolar transistor input protection Scott Craft, Stephen P. Robb 1992-08-18
5134448 MOSFET with substrate source contact Robert John Johnsen 1992-07-28
5028741 High frequency, power semiconductor device Randy L. Pollock 1991-07-02
5023196 Method for forming a MOSFET with substrate source contact Robert John Johnsen 1991-06-11