Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132099 | LDMOS transistor with implant alignment spacers | Rodney Arlan Barksdale, Stephen C. Chew, Martin Garcia, Wayne Geoffrey Risner | 2024-10-29 |
| 11664443 | LDMOS transistor with implant alignment spacers | Rodney Arlan Barksdale, Stephen C. Chew, Martin Garcia, Wayne Geoffrey Risner | 2023-05-30 |
| 10672703 | Transistor with shield structure, packaged device, and method of fabrication | Vikas Shilimkar, Kevin Kim, Humayun Kabir | 2020-06-02 |
| 10644148 | Active semiconductor device on high-resistivity substrate and method therefor | Xiaowei Ren, Rodney Arlan Barksdale | 2020-05-05 |
| 10593619 | Transistor shield structure, packaged device, and method of manufacture | Ibrahim Khalil, Charles John Lessard, Damon G. Holmes | 2020-03-17 |
| 10147686 | Transistor with shield structure, packaged device, and method of manufacture | Charles John Lessard, Damon G. Holmes, David C. Burdeaux, Ibrahim Khalil | 2018-12-04 |
| 10103233 | Transistor die with drain via arrangement, and methods of manufacture thereof | Ibrahim Khalil, David C. Burdeaux, Damon G. Holmes, Partha Chakraborty | 2018-10-16 |
| 9818862 | Semiconductor device with floating field plates | Zihao M. Gao, David C. Burdeaux, Wayne R. Burger, Christopher P. Dragon | 2017-11-14 |
| 9653410 | Transistor with shield structure, packaged device, and method of manufacture | Damon G. Holmes, David C. Burdeaux, Partha Chakraborty, Ibrahim Khalil | 2017-05-16 |
| 8518764 | Semiconductor structure having a through substrate via (TSV) and method for forming | Thuy B. Dao, Joel E. Keys, Paul W. Sanders | 2013-08-27 |
| 8324064 | Methods for forming varactor diodes | Pamela J. Welch, Wen-Ling M. Huang, David G. Morgan, Vishal P. Trivedi | 2012-12-04 |