| 12349433 |
Transistors with self-aligned source-connected field plates |
Bernhard Grote, Philippe Renaud, Humayun Kabir, Bruce M. Green |
2025-07-01 |
|
| 12336254 |
Semiconductor device with conductive elements formed over dielectric layers and method of fabrication therefor |
Bernhard Grote, Humayun Kabir, Bruce M. Green |
2025-06-17 |
|
| 12327778 |
Transistor die with primary and ancillary transistor elements |
Humayun Kabir, Bruce M. Green |
2025-06-10 |
|
| 12191383 |
Semiconductor device with an insulating region formed between a control electrode and a conductive element and method of fabrication therefor |
Bruce M. Green, Bernhard Grote |
2025-01-07 |
|
| 12159845 |
Transistor with integrated passive components |
Humayun Kabir, Vikas Shilimkar, Kevin Kim |
2024-12-03 |
$90,968,000 |
| 12119300 |
Transistor circuits with shielded reference transistors |
Humayun Kabir, Daniel J. Lamey, Yu-Ting David Wu |
2024-10-15 |
$55,104,000 |
| 11923424 |
Semiconductor device with conductive elements formed over dielectric layers and method of fabrication therefor |
Bernhard Grote, Humayun Kabir, Bruce M. Green |
2024-03-05 |
$36,788,000 |
| 11842957 |
Amplifier modules and systems with ground terminals adjacent to power amplifier die |
Jeffrey K. Jones, Kevin Kim, Freek Egbert van Straten |
2023-12-12 |
$90,522,000 |
| 11804527 |
Transistor with center fed gate |
Vikas Shilimkar, Kevin Kim, Daniel J. Lamey, Bruce M. Green, Humayun Kabir |
2023-10-31 |
$56,809,000 |
| 11502026 |
Transistor with flip-chip topology and power amplifier containing same |
Vikas Shilmkar, Ramanujam Srinidhi Embar |
2022-11-15 |
$11,886,000 |
| 11444044 |
Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies |
Ning Zhu, Darrell G. Hill, Damon G. Holmes |
2022-09-13 |
$38,752,000 |
| 11430743 |
Transistor with shield system including multilayer shield structure arrangement |
Humayun Kabir, Michele L. Miera, Charles John Lessard |
2022-08-30 |
$22,769,000 |
| 11430874 |
Semiconductor device with a crossing region |
Humayun Kabir |
2022-08-30 |
$22,769,000 |
| 11387169 |
Transistor with I/O ports in an active area of the transistor |
Kevin Kim, Humayun Kabir |
2022-07-12 |
$31,876,000 |
| 11302609 |
Radio frequency power dies having flip-chip architectures and power amplifier modules containing the same |
Charles John Lessard, Jeffrey K. Jones |
2022-04-12 |
$62,180,000 |
| 11121072 |
Semiconductor device with isolation structure |
Ning Zhu, Jeffrey Spencer Roberts, Damon G. Holmes |
2021-09-14 |
$98,250,000 |
| 11108361 |
Integrated multiple-path power amplifier with interdigitated transistors |
Hussain H. Ladhani, Humayun Kabir |
2021-08-31 |
$22,807,000 |
| 10826439 |
Linearity enhancement of high power amplifiers |
Ramanujam Srinidhi Embar, Abdulrhman M. S. Ahmed, Ricardo Uscola |
2020-11-03 |
$9,173,000 |
| 10615510 |
Feed structure, electrical component including the feed structure, and module |
Hussain H. Ladhani, Henry Andre Christange |
2020-04-07 |
$7,436,000 |
| 10593619 |
Transistor shield structure, packaged device, and method of manufacture |
Charles John Lessard, Damon G. Holmes, Hernan Rueda |
2020-03-17 |
|
| 10422033 |
Green method for coating a substrate with silver nanoparticles |
Mutasim Ibrahim Khalil |
2019-09-24 |
|
| 10147686 |
Transistor with shield structure, packaged device, and method of manufacture |
Charles John Lessard, Damon G. Holmes, David C. Burdeaux, Hernan Rueda |
2018-12-04 |
$13,179,000 |
| 10103233 |
Transistor die with drain via arrangement, and methods of manufacture thereof |
David C. Burdeaux, Damon G. Holmes, Hernan Rueda, Partha Chakraborty |
2018-10-16 |
$9,974,000 |
| 9800213 |
Amplifier devices with impedance matching networks that incorporate a capacitor integrated with a bond pad |
Ebrahim M. Al Seragi, Jeffrey K. Jones |
2017-10-24 |
$4,908,000 |
| 9653410 |
Transistor with shield structure, packaged device, and method of manufacture |
Damon G. Holmes, David C. Burdeaux, Partha Chakraborty, Hernan Rueda |
2017-05-16 |
$8,852,000 |