Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Amplifier modules and systems with ground terminals adjacent to power amplifier die

Amplifier modules and systems with ground terminals adjacent to power amplifier die

US Patent 11842957 · Granted Dec 12, 2023

Estimated economic value: $90,522,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of fabricating substrates with thermal vias and sinter-bonded thermal di2025
Low-stress thermal interface2025
Combination roller blind with fine adjustment function for shading2025
Transistors with self-aligned source-connected field plates2025
Semiconductor device with conductive elements formed over dielectric layers and 2025
Transistor die with primary and ancillary transistor elements2025
Packaged power amplifier device2025
Packaged power amplifier device with air cavity over die2025
Compact transistor utilizing shield structure arrangement2025
Semiconductor device with an insulating region formed between a control electrod2025
Transistor with integrated passive components2024
Transistor with integrated passive components2024