Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074743 | Trench MOSFET shield poly contact | Ganming Qin, Edouard D. de Frésart, Pon Sung Ku, Moaniss Zitouni, Dragan Zupac | 2018-09-11 |
| 9871008 | Monolithic microwave integrated circuits | Paul W. Sanders, Wayne R. Burger, Thuy B. Dao, Joel E. Keys, Robert A. Pryor +1 more | 2018-01-16 |
| 9837299 | Methods of forming 3-D circuits with integrated passive devices | Paul W. Sanders, Robert E. Jones, Chandrasekaram Ramiah | 2017-12-05 |
| 9698131 | Methods of forming 3-D circuits with integrated passive devices | Paul W. Sanders, Robert E. Jones, Chandrasekaram Ramiah | 2017-07-04 |
| 9680003 | Trench MOSFET shield poly contact | Ganming Qin, Edouard D. de Frésart, Pon Sung Ku, Moaniss Zitouni, Dragan Zupac | 2017-06-13 |
| 9508599 | Methods of making a monolithic microwave integrated circuit | Paul W. Sanders, Wayne R. Burger, Thuy B. Dao, Joel E. Keys, Robert A. Pryor +1 more | 2016-11-29 |
| 9419128 | Bidirectional trench FET with gate-based resurf | Moaniss Zitouni, Edouard D. de Frésart, Pon Sung Ku, Ganming Qin, Evgueniy Stefanov +1 more | 2016-08-16 |
| 9397213 | Trench gate FET with self-aligned source contact | Ganming Qin, Edouard D. de Frésart, Pon Sung Ku, Moaniss Zitouni, Dragan Zupac | 2016-07-19 |
| 9236365 | Methods of forming 3-D circuits with integrated passive devices | Paul W. Sanders, Robert E. Jones, Chandrasekaram Ramiah | 2016-01-12 |
| 9178027 | Bidirectional trench FET with gate-based resurf | Moaniss Zitouni, Edouard D. de Frésart, Pon Sung Ku, Ganming Qin, Evgueniy Stefanov +1 more | 2015-11-03 |
| 9064712 | Monolithic microwave integrated circuit | Paul W. Sanders, Wayne R. Burger, Thuy B. Dao, Joel E. Keys, Robert A. Pryor +1 more | 2015-06-23 |
| 8722459 | Methods of forming 3-D circuits with integrated passive devices | Paul W. Sanders, Robert E. Jones | 2014-05-13 |
| 8344503 | 3-D circuits with integrated passive devices | Paul W. Sanders, Robert E. Jones, Chandrasekaram Ramiah | 2013-01-01 |
| 8329579 | Through substrate VIAS | Paul W. Sanders, Chandrasekaram Ramiah | 2012-12-11 |
| 8283207 | Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods | Chandrasekaram Ramiah, Douglas G. Mitchell, Paul W. Sanders | 2012-10-09 |
| 8062975 | Through substrate vias | Paul W. Sanders, Chandrasekaram Ramiah | 2011-11-22 |
| 7935571 | Through substrate vias for back-side interconnections on very thin semiconductor wafers | Chandrasekaram Ramiah, Douglas G. Mitchell, Paul W. Sanders | 2011-05-03 |
| 7136028 | Applications of a high impedance surface | Ramamurthy Ramprasad, Chi-Taou Tsai | 2006-11-14 |
| 7136029 | Frequency selective high impedance surface | Ramamurthy Ramprasad, Chi-Taou Tsai | 2006-11-14 |
| 6943650 | Electromagnetic band gap microwave filter | Ramamurthy Ramprasad | 2005-09-13 |
| 5360979 | Fast turn-off circuit for solid-state relays or the like | Jerome Joseph, Steven B. Witmer | 1994-11-01 |