Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5508230 | Method for making a semiconductor device with diamond heat dissipation layer | George F. Anderson | 1996-04-16 |
| 5388027 | Electronic circuit assembly with improved heatsinking | George F. Anderson | 1995-02-07 |
| 5354717 | Method for making a substrate structure with improved heat dissipation | George F. Anderson | 1994-10-11 |
| 5054194 | Method for controlling bonding wire loop weight | — | 1991-10-08 |
| 5028741 | High frequency, power semiconductor device | Paul W. Sanders | 1991-07-02 |