Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11433172 | Fluidic devices, methods, and systems | Cheng Zhang, Yuan Hong, Feng Xu | 2022-09-06 |
| 10598577 | Photodegradable sample collection system and method | Arunkumar Natarajan, John Richard Nelson, Patrick McCoy Spooner, Ralf Lenigk, Kwok Pong Chan +3 more | 2020-03-24 |
| 10507278 | Fluidic devices, methods, and systems | Cheng Zhang, Yuan Hong, Feng Xu | 2019-12-17 |
| 10494627 | Extraction of materials from regions of interest in a sample | John Richard Nelson, Christopher Michael Puleo, Todd F. Miller, Christine Lynne Pitner, David Andrew Shoudy +1 more | 2019-12-03 |
| 10283477 | Method of fabricating 3-dimensional fan-out structure | Zhiwei Gong, Dehong Ye | 2019-05-07 |
| 10083912 | Method of packaging integrated circuit die and device | Zhiwei Gong | 2018-09-25 |
| 10068841 | Apparatus and methods for multi-die packaging | Zhiwei Gong | 2018-09-04 |
| 9721881 | Apparatus and methods for multi-die packaging | Zhiwei Gong | 2017-08-01 |
| 9625355 | Extraction of materials from regions of interest in a sample | John Richard Nelson, Christopher Michael Puleo, Todd F. Miller, Christine Lynne Pitner, David Andrew Shoudy +1 more | 2017-04-18 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Zhiwei Gong, Yanting Tian, Jinzhong Yao, Dehong Ye | 2016-06-07 |
| 9142434 | Method for singulating electronic components from a substrate | Craig Amrine, Zhiwei Gong, Scott M. Hayes, Lizabeth Keser, George R. Leal +1 more | 2015-09-22 |
| 9034697 | Apparatus and methods for quad flat no lead packaging | Zhiwei Gong, Jianwen Xu, Scott M. Hayes | 2015-05-19 |
| 8735223 | Semiconductor devices and methods of assembling same | Zhiwei Gong, Dehong Ye, Huchang Zhang | 2014-05-27 |
| 8329509 | Packaging process to create wettable lead flank during board assembly | Zhiwei Gong, Nageswara Rao Bonda, Jinsheng Wang, Dehong Ye | 2012-12-11 |