Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8329509 | Packaging process to create wettable lead flank during board assembly | Zhiwei Gong, Wei Gao, Jinsheng Wang, Dehong Ye | 2012-12-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8329509 | Packaging process to create wettable lead flank during board assembly | Zhiwei Gong, Wei Gao, Jinsheng Wang, Dehong Ye | 2012-12-11 |