Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283477 | Method of fabricating 3-dimensional fan-out structure | Wei Gao, Zhiwei Gong | 2019-05-07 |
| 9406625 | Die edge seal employing low-K dielectric material | Zhijie Wang, Zhigang Bai, Jiyong Niu, Huchang Zhang | 2016-08-02 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Wei Gao, Zhiwei Gong, Yanting Tian, Jinzhong Yao | 2016-06-07 |
| 8735223 | Semiconductor devices and methods of assembling same | Wei Gao, Zhiwei Gong, Huchang Zhang | 2014-05-27 |
| 8329509 | Packaging process to create wettable lead flank during board assembly | Zhiwei Gong, Nageswara Rao Bonda, Wei Gao, Jinsheng Wang | 2012-12-11 |
| 8288847 | Dual die semiconductor package | Meiquan Huang, Hejin Liu, Wenjian Xu | 2012-10-16 |
| 7887928 | Coated lead frame | Chao Wang, Qing He, Zhe Li, Zhijie Wang | 2011-02-15 |