Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9129948 | Semiconductor device and method of assembling same | Huan Wang, Jinsheng Wang, Naikou Zhou | 2015-09-08 |
| 8907464 | Helix substrate and three-dimensional package with same | Huan Wang, Hejin Liu | 2014-12-09 |
| 8878348 | Semiconductor device and method of assembling same | Huan Wang, Jinsheng Wang, Naikuo Zhou | 2014-11-04 |
| 8524529 | Brace for wire bond | Hejin Liu, Hanmin Zhang | 2013-09-03 |
| 8496158 | Method and apparatus for monitoring free air ball (FAB) formation in wire bonding | Fei Zong, Guoliang Gong, Hejin Liu | 2013-07-30 |
| 8288847 | Dual die semiconductor package | Hejin Liu, Wenjian Xu, Dehong Ye | 2012-10-16 |