Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613941 | Exposed die power semiconductor device | Yanbo Xu, Zhijie Wang | 2017-04-04 |
| 9362212 | Integrated circuit package having side and bottom contact pads | Yanbo Xu, Jianshe Bi, Jinsheng Wang, Zhijie Wang | 2016-06-07 |
| 9252114 | Semiconductor device grid array package | Zhijie Wang, Zhigang Bai, Aipeng Shu, Yanbo Xu, Huchang Zhang | 2016-02-02 |
| 9214413 | Semiconductor die package with pre-molded die | Zhijie Wang, Zhigang Bai, Aipeng Shu, Yanbo Xu, Huchang Zhang | 2015-12-15 |
| 8496158 | Method and apparatus for monitoring free air ball (FAB) formation in wire bonding | Guoliang Gong, Meiquan Huang, Hejin Liu | 2013-07-30 |