Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9498898 | Cleaning mechanism for semiconductor singulation saws | Zhijie Wang, Zhigang Bai, Mei Liu, Jiyong Niu, Zhimei Sun | 2016-11-22 |
| 9406625 | Die edge seal employing low-K dielectric material | Zhijie Wang, Zhigang Bai, Jiyong Niu, Dehong Ye | 2016-08-02 |
| 9397066 | Bond wire feed system and method therefor | Zhijie Wang, Zhigang Bai | 2016-07-19 |
| 9252114 | Semiconductor device grid array package | Zhijie Wang, Zhigang Bai, Aipeng Shu, Yanbo Xu, Fei Zong | 2016-02-02 |
| 9214413 | Semiconductor die package with pre-molded die | Zhijie Wang, Zhigang Bai, Aipeng Shu, Yanbo Xu, Fei Zong | 2015-12-15 |
| 8735223 | Semiconductor devices and methods of assembling same | Wei Gao, Zhiwei Gong, Dehong Ye | 2014-05-27 |