Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252114 | Semiconductor device grid array package | Zhijie Wang, Zhigang Bai, Yanbo Xu, Huchang Zhang, Fei Zong | 2016-02-02 |
| 9214413 | Semiconductor die package with pre-molded die | Zhijie Wang, Zhigang Bai, Yanbo Xu, Huchang Zhang, Fei Zong | 2015-12-15 |
| 9024427 | Multiple helix substrate and three-dimensional package with same | Huan Wang, Shu An Yao | 2015-05-05 |