Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613941 | Exposed die power semiconductor device | Zhijie Wang, Fei Zong | 2017-04-04 |
| 9362212 | Integrated circuit package having side and bottom contact pads | Jianshe Bi, Jinsheng Wang, Zhijie Wang, Fei Zong | 2016-06-07 |
| 9252114 | Semiconductor device grid array package | Zhijie Wang, Zhigang Bai, Aipeng Shu, Huchang Zhang, Fei Zong | 2016-02-02 |
| 9214413 | Semiconductor die package with pre-molded die | Zhijie Wang, Zhigang Bai, Aipeng Shu, Huchang Zhang, Fei Zong | 2015-12-15 |
| 9196557 | Protective packaging for integrated circuit device | Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo | 2015-11-24 |
| 8652384 | Method for molding semiconductor device | Quan Chen, Wei Gai | 2014-02-18 |