Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209119 | Semiconductor device assembled using two lead frames | Huan Wang, Weiping Sun | 2015-12-08 |
| 8907464 | Helix substrate and three-dimensional package with same | Huan Wang, Meiquan Huang | 2014-12-09 |
| 8524529 | Brace for wire bond | Meiquan Huang, Hanmin Zhang | 2013-09-03 |
| 8496158 | Method and apparatus for monitoring free air ball (FAB) formation in wire bonding | Fei Zong, Guoliang Gong, Meiquan Huang | 2013-07-30 |
| 8288847 | Dual die semiconductor package | Meiquan Huang, Wenjian Xu, Dehong Ye | 2012-10-16 |