Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8980696 | Method of packaging semiconductor die | Dominic Koey Poh Meng, Kesvakumar V. C. Muniandy, Weng F. Yap | 2015-03-17 |
| 8916421 | Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits | Navjot Chhabra, Glenn G. Daves, Scott M. Hayes | 2014-12-23 |
| 8735223 | Semiconductor devices and methods of assembling same | Wei Gao, Dehong Ye, Huchang Zhang | 2014-05-27 |
| 8617935 | Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages | Jianwen Xu, Scott M. Hayes | 2013-12-31 |
| 8597983 | Semiconductor device packaging having substrate with pre-encapsulation through via formation | Navjot Chhabra, Glenn G. Daves, Scott M. Hayes | 2013-12-03 |
| 8329509 | Packaging process to create wettable lead flank during board assembly | Nageswara Rao Bonda, Wei Gao, Jinsheng Wang, Dehong Ye | 2012-12-11 |
| 8216918 | Method of forming a packaged semiconductor device | Scott M. Hayes, George R. Leal, Douglas G. Mitchell, Jason Wright, Jianwen Xu | 2012-07-10 |