Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969436 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Lisa J. Jimarez, Keith P. Brodock | 2005-11-29 |
| 6967705 | Lamination of liquid crystal polymer dielectric films | Mark D. Poliks | 2005-11-22 |
| 6931726 | Method of making and interconnect structure | Christina M. Boyko, Konstantinos I. Papathomas | 2005-08-23 |
| 6929900 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Claudius Feger, Voya R. Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw +2 more | 2005-08-16 |
| 6902869 | Manufacturing methods for printed circuit boards | Bernd Karl Appelt, James R. Bupp, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more | 2005-06-07 |
| 6843929 | Accelerated etching of chromium | Edmond O. Fey, Elizabeth Foster, Michael Joseph Klodowski, Paul George Rickerl | 2005-01-18 |
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2004-12-14 |
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell | 2004-12-07 |
| 6819373 | Lamination of liquid crystal polymer dielectric films | Mark D. Poliks | 2004-11-16 |
| 6776852 | Process of removing holefill residue from a metallic surface of an electronic substrate | Christina M. Boyko, Brian E. Curcio, Michael Wozniak | 2004-08-17 |
| 6764748 | Z-interconnections with liquid crystal polymer dielectric films | Douglas O. Powell | 2004-07-20 |
| 6700078 | Formation of multisegmented plated through holes | Robert M. Japp, John M. Lauffer, Konstantinos I. Papathomas | 2004-03-02 |
| 6684497 | Manufacturing methods for printed circuit boards | Bernd Karl Appelt, James R. Bupp, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more | 2004-02-03 |
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Claudius Feger, Voya R. Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw +2 more | 2004-02-03 |
| 6675852 | Platen for use in laminating press | Varaprasad V. Calmidi, Michael Joseph Klodowski, Randall J. Stutzman | 2004-01-13 |
| 6660945 | Interconnect structure and method of making same | Christina M. Boyko, Konstantinos I. Papathomas | 2003-12-09 |
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Konstantinos I. Papathomas, Mark D. Poliks | 2003-11-11 |
| 6638607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Lisa J. Jimarez, Keith P. Brodock | 2003-10-28 |
| 6639155 | High performance packaging platform and method of making same | James R. Bupp, Lisa J. Jimarez | 2003-10-28 |
| 6634543 | Method of forming metallic z-interconnects for laminate chip packages and boards | Brian E. Curcio, Elizabeth Foster, Amit K. Sarkhel | 2003-10-21 |
| 6609296 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Voya R. Markovich, Kostas Papathomas, Leonard L. Schmidt | 2003-08-26 |
| 6599833 | Method and article for filling apertures in a high performance electronic substrate | Konstantinos I. Papathomas | 2003-07-29 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Raymond T. Galasco, Sung Kwon Kang, Mark D. Poliks, Chandrika Prasad, Roy Yu | 2003-07-29 |
| 6589639 | Hole fill composition and method for filling holes in a substrate | Konstantinos I. Papathomas | 2003-07-08 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation | Michael Joseph Klodowski, Konstantinos I. Papathomas, James R. Wilcox | 2003-05-27 |