Issued Patents All Time
Showing 76–82 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5981312 | Method for injection molded flip chip encapsulation | Michael Joseph Klodowski, Konstantinos I. Papathomas, James R. Wilcox | 1999-11-09 |
| 5925206 | Practical method to make blind vias in circuit boards and other substrates | Chris M. Boyko, David B. Stone, Richard J. Supa | 1999-07-20 |
| 5900675 | Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates | Bernd Karl Appelt, Robert M. Japp, Konstantinos I. Papathomas | 1999-05-04 |
| 5872337 | Chip carrier and cable assembly reinforced at edges | Stephen Joseph Fuerniss, Charles R. Davis, David L. Questad, Darbha Suryanarayana, Jeffrey Zimmerman | 1999-02-16 |
| 5847324 | High performance electrical cable | William L. Brodsky, Natalie B. Feilchenfeld, Lisa J. Jimarez, James R. Wilcox | 1998-12-08 |
| 5792375 | Method for bonding copper-containing surfaces together | — | 1998-08-11 |
| 5784782 | Method for fabricating printed circuit boards with cavities | Christina M. Boyko, Robert M. Japp, Michael Joseph Klodowski | 1998-07-28 |