Issued Patents All Time
Showing 26–50 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6834426 | Method of fabricating a laminate circuit structure | Gregory Kevern, William J. Rudik | 2004-12-28 |
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Gerald W. Jones, John S. Kresge +3 more | 2004-12-14 |
| 6820332 | Laminate circuit structure and method of fabricating | Voya R. Markovich, Konstantinos I. Papathomas | 2004-11-23 |
| 6790305 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Frank D. Egitto, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2004-09-14 |
| 6734259 | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom | Konstantinos I. Papathomas, Cory J. Ruud | 2004-05-11 |
| 6722031 | Method for making printed circuit board having low coefficient of thermal expansion power/ground plane | Mark D. Poliks | 2004-04-20 |
| 6700078 | Formation of multisegmented plated through holes | Donald S. Farquhar, John M. Lauffer, Konstantinos I. Papathomas | 2004-03-02 |
| 6669805 | Drill stack formation | Gregory Kevern, Francis S. Poch | 2003-12-30 |
| 6613413 | Porous power and ground planes for reduced PCB delamination and better reliability | Mark D. Poliks | 2003-09-02 |
| 6586352 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, William J. Rudik, John Frank Surowka | 2003-07-01 |
| 6534179 | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use | Konstantinos I. Papathomas, Mark D. Poliks | 2003-03-18 |
| 6496356 | Multilayer capacitance structure and circuit board containing the same and method of forming the same | John M. Lauffer, Konstantinos I. Papathomas | 2002-12-17 |
| 6459047 | Laminate circuit structure and method of fabricating | Voya R. Markovich, Konstantinos I. Papathomas | 2002-10-01 |
| 6429384 | Chip C4 assembly improvement using magnetic force and adhesive | Francis J. Downes, Jr., Mark V. Pierson | 2002-08-06 |
| 6426470 | Formation of multisegmented plated through holes | Donald S. Farquhar, John M. Lauffer, Konstantinos I. Papathomas | 2002-07-30 |
| 6399896 | Circuit package having low modulus, conformal mounting pads | Frank J. Downes, Jr., Donald S. Farquhar, William J. Rudik | 2002-06-04 |
| 6387205 | Dustfree prepreg and method for making an article based thereon | Bernd Karl Appelt, William Thomas Fotorny, Kostantinos Papathomas, Mark D. Poliks | 2002-05-14 |
| 6387830 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, William J. Rudik, John Frank Surowka | 2002-05-14 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6355364 | Process of heat treating and annealing CIC and CIC created thereby | Lisa J. Jimarez, Bonnie McClure | 2002-03-12 |
| 6351030 | Electronic package utilizing protective coating | Ross Downey Havens, Jeffrey Alan Knight, Mark D. Poliks, Anne Marie Quinn | 2002-02-26 |
| 6343001 | Multilayer capacitance structure and circuit board containing the same | John M. Lauffer, Konstantinos I. Papathomas | 2002-01-29 |
| 6329603 | Low CTE power and ground planes | Mark D. Poliks | 2001-12-11 |
| 6214525 | Printed circuit board with circuitized cavity and methods of producing same | Christina M. Boyko, Donald S. Farquhar, Michael Joseph Klodowski | 2001-04-10 |
| 6207595 | Laminate and method of manufacture thereof | Bernd Karl Appelt, Lawrence Robert Blumberg, William Thomas Fotorny, Ross Downey Havens, Kostas Papathomas +3 more | 2001-03-27 |